1. 2. 3. material content data sheet sales product name spp15p10pl h issued 29. august 2013 ma# MA000669536 package pg-to220-3-1 weight* 2030.81 mg construction element material group substances cas# if applicable weight [mg] average mass [%] sum [%] average mass [ppm] sum [ppm] chip inorganic material silicon 7440-21-3 3.612 0.18 0.18 1779 1779 leadframe non noble metal iron 7439-89-6 0.816 0.04 402 inorganic material phosphorus 7723-14-0 0.245 0.01 121 non noble metal copper 7440-50-8 815.335 40.14 40.19 401482 402006 wire non noble metal aluminium 7429-90-5 1.503 0.07 0.07 740 740 encapsulation organic material carbon black 1333-86-4 5.953 0.29 2931 plastics epoxy resin - 113.102 5.57 55693 inorganic material silicondioxide 60676-86-0 476.220 23.45 29.31 234499 293123 leadfinish non noble metal tin 7440-31-5 21.462 1.06 1.06 10568 10568 plating non noble metal nickel 7440-02-0 0.244 0.01 120 inorganic material phosphorus 7723-14-0 0.001 0.00 0.01 1 120 solder non noble metal antimony 7440-36-0 0.208 0.01 102 noble metal silver 7440-22-4 0.520 0.03 256 non noble metal tin 7440-31-5 1.351 0.07 0.11 665 1023 heatspreader non noble metal iron 7439-89-6 0.590 0.03 291 inorganic material phosphorus 7723-14-0 0.177 0.01 87 non noble metal copper 7440-50-8 589.466 29.03 29.07 290263 290641 *deviation < 10% sum in total: 100,00 1000000 important remarks: infineon technologies ag provides full material declaration based on information provided by third parties and has taken and continues to take reasonable steps to provide representative and accurate information. infineon technologies ag and infineon technologies ag suppliers consider certain information to be proprietary, and thus cas numbers and other limited information may not be available for release. all statements are based on our present knowledge, are provided 'as is' and may be subject to change at any time due to technical requirements and development without notification. company infineon technologies ag address 81726 mnchen internet www.infineon.com
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